Anbieter: HQ-Dielectrics GmbH

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2017-07-05 Rapid Thermal Processing Tool for forming metal contacts on the semiconductor material SiC with ohmic behaviour (Fraunhofer Gesellschaft zur Förderung der angewandten Forschung e.V. über Vergabeportal deutsche eVergabe)
Rapid Thermal Processing Tool for forming metal contacts on the semiconductor material SiC with ohmic behaviour Manual handling; SiC wafer processing in SiC coated graphite boxes without wafer rotation, but also Si wafer processing without boxes with wafer rotation; applicable for wafer diameter: 100 mm, 150 mm, and 200 mm; low temperature measurement set-up (500°C) and high temperature measurement set-up (1 200°C); atmospheric chamber configuration; active chamber cooling; oxygen sensor for process … Ansicht der Beschaffung »
Erwähnte Lieferanten: HQ-Dielectrics GmbH

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