Lithography system: resist coating and developing tool, mask aligner
Specification for lithography system A + B.
A. Automated resist coating and developing tool.
The process area of the new resist coating and developing system should cover a wide variety of resist materials and substrates.
Different applications in microsystems and nanotechnology with a focus on biomedical applications and biosensor development and production are addressed.
Therefore customized configurations of coat, bake, develop, and chill modules are necessary. Flexibility should be ensured by programmable processes and possible conversion to different substrate sizes. The system should allow R&D as well as high volume processes.
The system should be modular with coat, bake, develop and chill modules. Carriers should be able to be used in other systems.
B. Mask aligner.
Substrates coated in system A should be processed in the mask aligner and developed in system A. Carriers should be able to be used in other systems.
The lithography tools should be flexible to operate in manual mode with new and different substrates (glass, silicon wafers, polymer foils), processes and materials. Semi-automatic and also automated processing of the substrates is possible. Software should be user-friendly comparable to those of system A.
Deadline
Die Frist für den Eingang der Angebote war 2011-06-17.
Die Ausschreibung wurde veröffentlicht am 2011-05-10.
Anbieter
Die folgenden Lieferanten werden in Vergabeentscheidungen oder anderen Beschaffungsunterlagen erwähnt:
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Geschichte der Beschaffung
| Datum |
Dokument |
| 2011-05-10
|
Auftragsbekanntmachung
|
| 2011-10-21
|
Bekanntmachung über vergebene Aufträge
|