Fraunhofer IMS requires a new or refurbished fully automated wafer bonding system. In this system 8" (200 mm) wafers with different surface material (silicon oxide or silicon nitride) can be bonded together by a direct fusion bond according to the specifications below. The bond process can be performed under atmosphere or under controlled vacuum (< le-5 mbar) with the possibility to encapsulate a gas (N2, Ar, etc.) under a specific pressure. In this wafer bonder the wafers are loaded automatically by a robot handler from at least 2 cassettes. The whole system contains at least 1 cleaning module, 1 plasma activation module, 1 fully automated bond aligner, 1 bond chamber and a wafer handling system. Further specifications for each module are given below.
The wafer bonder includes software which offers different user access levels for operating and engineering level. Bonding recipes for each wafer must be selectable individually.
Deadline
Die Frist für den Eingang der Angebote war 2018-04-03.
Die Ausschreibung wurde veröffentlicht am 2018-03-05.
Anbieter
Die folgenden Lieferanten werden in Vergabeentscheidungen oder anderen Beschaffungsunterlagen erwähnt:
Objekt Umfang der Beschaffung
Titel: Automatischer Waferprober
E_038_234641 ChrPat-wit FMD
Produkte/Dienstleistungen: Maschinen und Geräte zum Prüfen und Messen📦
Kurze Beschreibung:
“Fraunhofer IMS requires a new or refurbished fully automated wafer bonding system. In this system 8" (200 mm) wafers with different surface material...”
Kurze Beschreibung
Fraunhofer IMS requires a new or refurbished fully automated wafer bonding system. In this system 8" (200 mm) wafers with different surface material (silicon oxide or silicon nitride) can be bonded together by a direct fusion bond according to the specifications below. The bond process can be performed under atmosphere or und er controlled vacuum (< le-5 mbar) with the possibility to encapsulate a gas (N2, Ar, etc.) under a specific pressure. In this wafer bonder the wafers are loaded automatically by a robot handler from at least two cassettes. The whole system contains at least one cleaning module, one plasma activation module, one fully automated bond aligner, one bond chamber and a wafer handling system. Further specifications for each module are given below.
The wafer bonder includes software which offers different user access levels for operating and engineering level. Bonding recipes for each wafer must be selectable individually.
Ergänzende Informationen Referenz der ursprünglichen Mitteilung
Nummer der Bekanntmachung im Amtsblatt S: 2018/S 046-100468
Änderungen Zu berichtigender Text in der ursprünglichen Bekanntmachung
Nummer des Abschnitts: II.1.2
Ort des zu ändernden Textes: Main CPV code
Alter Wert
Text: 38540000
Neuer Wert
Text: 42990000
Zu berichtigender Text in der ursprünglichen Bekanntmachung
Nummer des Abschnitts: II.1.1
Ort des zu ändernden Textes: Title
Alter Wert
Text: Automatischer Waferprober
Neuer Wert
Text: Automated wafer bonding system
Quelle: OJS 2018/S 053-117339 (2018-03-15)
Bekanntmachung über vergebene Aufträge (2019-02-04) Öffentlicher Auftraggeber Art des öffentlichen Auftraggebers
Andere Art: Forschungsgesellschaft e. V.
Objekt Umfang der Beschaffung
Kurze Beschreibung:
“Fraunhofer IMS requires a new or refurbished fully automated wafer bonding system. In this system 8" (200 mm) wafers with different surface material...”
Kurze Beschreibung
Fraunhofer IMS requires a new or refurbished fully automated wafer bonding system. In this system 8" (200 mm) wafers with different surface material (silicon oxide or silicon nitride) can be bonded together by a direct fusion bond according to the specifications below. The bond process can be performed under atmosphere or under controlled vacuum (< le-5 mbar) with the possibility to encapsulate a gas (N2, Ar, etc.) under a specific pressure. In this wafer bonder the wafers are loaded automatically by a robot handler from at least 2 cassettes. The whole system contains at least one cleaning module, one plasma activation module, one fully automated bond aligner, one bond chamber and a wafer handling system. Further specifications for each module are given below.
The wafer bonder includes software which offers different user access levels for operating and engineering level. Bonding recipes for each wafer must be selectable individually.
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Gesamtwert der Beschaffung (ohne MwSt.): EUR 0.01 💰
1️⃣
Ort der Leistung: Duisburg, Kreisfreie Stadt🏙️
Hauptstandort oder Erfüllungsort: 47057 Duisburg
Beschreibung der Beschaffung:
“Fraunhofer IMS requires a new or refurbished fully automated wafer bonding system. In this system 8" (200 mm) wafers with different surface material...”
Beschreibung der Beschaffung
Fraunhofer IMS requires a new or refurbished fully automated wafer bonding system. In this system 8" (200 mm) wafers with different surface material (silicon oxide or silicon nitride)
Can be bonded together by a direct fusion bond according to the specifications below. The bond process can be performed under atmosphere or under controlled vacuum (< le-5 Mbar) with the possibility to encapsulate a gas (N2, Ar, etc.) under a specific pressure. In this wafer bonder the wafers are loaded automatically by a robot handler from at least 2 cassettes. The whole system contains at least one cleaning module, one plasma activation module, one fully automated bond aligner, one bond chamber and a wafer handling system. Further specifications for each module are given below. the wafer bonder includes software which offers different user access levels for operating and engineering level. Bonding recipes for each wafer must be selectable individually.
The system has to be installed by the manufacturer as “stand-alone" or “through the wall" in the clean room at Fraunhofer IMS and must conform to CMOS compatible clean room conditions (dass 10). Fraunhofer IMS prepares the clean room for the system installation. The system has to be designed for a 24 h operation in all-year mode (continuous operation).
For proven reliability the duster system, at least the bond chamber and the aligner, must be installed in more than 20 units worldwide in a production environment.
The system has to allow a completely safe process run without any risk for the health of the operator (CE certificated).
Because of limited cleanroom space the mainframe of the bonder system should have a footprint smaller than 4,2 m x 2,2 m. Electronic racks, vacuum pumps, and a separate user console are not included in this limitation.
Mehr anzeigen Vergabekriterien
Qualitätskriterium (Bezeichnung): Service
Qualitätskriterium (Gewichtung): 10
Qualitätskriterium (Bezeichnung): Delivery time
Qualitätskriterium (Gewichtung): 15
Qualitätskriterium (Bezeichnung): Technical spezifikation
Qualitätskriterium (Gewichtung): 40
Preis (Gewichtung): 35
Informationen über Optionen
Optionen ✅
Beschreibung der Optionen: See specification.
Verfahren Art des Verfahrens
Wettbewerbliches Verfahren mit Verhandlung
Administrative Informationen
Frühere Veröffentlichungen zu diesem Verfahren: 2018/S 046-100468
Auftragsvergabe
1️⃣
Titel: Automatischer Waferprober
Datum des Vertragsabschlusses: 2018-12-11 📅
Informationen über Ausschreibungen
Anzahl der eingegangenen Angebote: 2
Name und Anschrift des Auftragnehmers
Name: SUSS Micro Tec Lithography GmbH
Postanschrift: Schleissheimer Str. 90
Postort: Garching b. München
Postleitzahl: 85748
Land: Deutschland 🇩🇪
Region: München, Landkreis🏙️
Der Auftragnehmer ist ein KMU ✅ Angaben zum Wert des Auftrags/der Partie (ohne MwSt.)
Gesamtwert des Auftrags/Loses: EUR 0.01 💰
“— Request of documents — available at: The award documents can be retrieved exclusively through the award portal of the German e-Vergabe...”
— Request of documents — available at: The award documents can be retrieved exclusively through the award portal of the German e-Vergabe at
www.deutsche-evergabe.de. With the tender submission, contenders are also subject to the provisions regarding unsuccessful tenders (§134 GWB [German Act Against Restraints of Competition]). Questions or remarks from the tenderer must be sent, in English only, exclusively via e-mail to the contact point named under No. I.1. As faras relevant, responses to the questions or remarks of the tenderer shall also be sent to all other tenderers.
Pursuant to Section 9 Par. 3 S. 2 VgV (German public procurement regulation), the contract notice and the award documents are available to you at the German eVergabe with or without registration.
Please note that registration is required for requests to participate, tender submissions and tenderer questions.
We therfore recommend early registration, also in order to receive any tenderer information; you other wise bear the risk of possible tender exclusion.
Mehr anzeigen Körper überprüfen
Name: Vergabekammer des Bundes beim Bundeskartellamt
Postanschrift: Villemombler Straße 76
Postort: Bonn
Postleitzahl: 53123
Land: Deutschland 🇩🇪 Für Mediationsverfahren zuständige Stelle
Name: Vergabeprüfstelle des BMBF Referat Z 23
Postanschrift: Heinemannstraße 2
Postort: Bonn
Postleitzahl: 53175
Land: Deutschland 🇩🇪 Verfahren zur Überprüfung
Genaue Informationen über Fristen für Überprüfungsverfahren:
“A request for review is inadmissible if more than 15 calendar days have passed since the receipt of the notification from the ordering party indicating a...”
Genaue Informationen über Fristen für Überprüfungsverfahren
A request for review is inadmissible if more than 15 calendar days have passed since the receipt of the notification from the ordering party indicating a lack of willingness to help with the objection (§ 160 Par. 3 Clause 1 No. 4 GWB ). A request for review is additionally inadmissible if the contract has been awarded before the Vergabekammer has informed the ordering party of the request for review (§§ 168 Par. 2 Clause 1, 169 Par. 1 GWB). The award of the contract is possible 15 calendar days after the dispatch of the tenderer information pursuant to § 134 Par. 1 GWB. If the information is sent electronically or via fax, this time period is reduced to ten calendar days (§ 134 Par. 2 GWB). The time period begins on the day after the dispatch of the information by the ordering party; the day on which it is received at the concerned tenderer and applicant is not relevant. The admissibility of a request for review furthermore presupposes that a complaint has been made to the ordering party with regard to the asserted procurement violations within 10 days after knowledge was obtained of it(§ 160 Par. 3 Clause 1 No. 1 GWB). Complaints regarding violations of procurement rules that are apparent on the basis of the announcement must be made to the ordering party before the expiration of the time period named in the announcement for the application or for the tendering (§ 160 Par. 3 Clause 1 No. 1 GWB). Complaints regarding violations of procurement rules that do not become apparent until appearing in the award documents must be made to the ordering party no later than by the expiration of the time period for the application or for the tendering (§ 160 Par. 3 Clause 1 No. 1 GWB).
Mehr anzeigen Dienststelle, bei der Informationen über das Überprüfungsverfahren eingeholt werden können
Name:
“Fraunhofer Gesellschaft zur Förderung der angewandten Forschung e.V. über Vergabeportal eVergabe”
Postanschrift: Hansastraße 27c
Postort: München
Postleitzahl: 80686
Land: Deutschland 🇩🇪
E-Mail: einkauf@zv.fraunhofer.de📧
URL: http://www.fraunhofer.de🌏
Quelle: OJS 2019/S 026-057539 (2019-02-04)