Automatischer Waferprober

Fraunhofer Gesellschaft zur Förderung der angewandten Forschung eV über Vergabeportal eVergabe

Fraunhofer IMS requires a new or refurbished fully automated wafer bonding system. In this system 8" (200 mm) wafers with different surface material (silicon oxide or silicon nitride) can be bonded together by a direct fusion bond according to the specifications below. The bond process can be performed under atmosphere or under controlled vacuum (< le-5 mbar) with the possibility to encapsulate a gas (N2, Ar, etc.) under a specific pressure. In this wafer bonder the wafers are loaded automatically by a robot handler from at least 2 cassettes. The whole system contains at least 1 cleaning module, 1 plasma activation module, 1 fully automated bond aligner, 1 bond chamber and a wafer handling system. Further specifications for each module are given below.
The wafer bonder includes software which offers different user access levels for operating and engineering level. Bonding recipes for each wafer must be selectable individually.

Deadline

Die Frist für den Eingang der Angebote war 2018-04-03. Die Ausschreibung wurde veröffentlicht am 2018-03-05.

Anbieter

Die folgenden Lieferanten werden in Vergabeentscheidungen oder anderen Beschaffungsunterlagen erwähnt:

• SUSS Micro Tec Lithography GmbH

Wer?

• Fraunhofer Gesellschaft zur Förderung der angewandten Forschung eV über Vergabeportal eVergabe

Wie?

• Apparate und Geräte zum Prüfen und Testen › Maschinen und Geräte zum Prüfen und Messen

Wo?

• Düsseldorf › Duisburg, Kreisfreie Stadt
• Oberbayern › München, Kreisfreie Stadt

Geschichte der Beschaffung

Datum	Dokument
2018-03-05	Auftragsbekanntmachung
2018-03-15	Ergänzende Angaben
2019-02-04	Bekanntmachung über vergebene Aufträge

Auftragsbekanntmachung (2018-03-05)
Objekt
Umfang der Beschaffung
Titel: Maschinen und Geräte zum Prüfen und Messen
Referenznummer: E_038_234641 ChrPat-wit FMD
Kurze Beschreibung:

Fraunhofer IMS requires a new or refurbished fully automated wafer bonding system. In this system 8" (200 mm) wafers with different surface material (silicon oxide or silicon nitride) can be bonded together by a direct fusion bond according to the specifications below. The bond process can be performed under atmosphere or under controlled vacuum (< le-5 mbar) with the possibility to encapsulate a gas (N2, Ar, etc.) under a specific pressure. In this wafer bonder the wafers are loaded automatically by a robot handler from at least 2 cassettes. The whole system contains at least 1 cleaning module, 1 plasma activation module, 1 fully automated bond aligner, 1 bond chamber and a wafer handling system. Further specifications for each module are given below. The wafer bonder includes software which offers different user access levels for operating and engineering level. Bonding recipes for each wafer must be selectable individually.

Metadaten der Bekanntmachung
Originalsprache: Englisch 🗣️
Dokumenttyp: Auftragsbekanntmachung
Art des Auftrags: Lieferungen
Verordnung: Europäische Union, mit GPA-Beteiligung
Gemeinsames Vokabular für öffentliche Aufträge (CPV)
Code: Maschinen und Geräte zum Prüfen und Messen 📦
Ort der Leistung
NUTS-Region: Duisburg, Kreisfreie Stadt 🏙️

Verfahren
Verfahrensart: Verhandlungsverfahren
Angebotsart: Angebot für alle Lose
Vergabekriterien
Wirtschaftlichstes Angebot

Öffentlicher Auftraggeber
Identität
Land: Deutschland 🇩🇪
Art des öffentlichen Auftraggebers: Sonstiges
Name des öffentlichen Auftraggebers: Fraunhofer Gesellschaft zur Förderung der angewandten Forschung eV über Vergabeportal eVergabe
Postanschrift: Hansastr. 27 c
Postleitzahl: 80686
Postort: München
Kontakt
Internetadresse: http://www.fraunhofer.de 🌏
E-Mail: fraunhofer@deutsche-evergabe.de 📧
URL der Dokumente: http://www.deutsche-evergabe.de/ 🌏
URL der Teilnahme: http://www.deutsche-evergabe.de/ 🌏

Referenz
Daten
Absendedatum: 2018-03-05 📅
Einreichungsfrist: 2018-04-03 📅
Veröffentlichungsdatum: 2018-03-07 📅
Kennungen
Bekanntmachungsnummer: 2018/S 046-100468
ABl. S-Ausgabe: 46
Zusätzliche Informationen

Request of documents — available at: The award documents can be retrieved exclusively through the award portal of the German e-Vergabe at www.deutsche-evergabe.de With the tender submission, contenders are also subject to the provisions regarding unsuccessful tenders (§ 134 GWB [German Act Against Restraints of Competition]). Questions or remarks from the tenderer must be sent, in English only, exclusively via email to the contact point named under nº I.1. As faras relevant, responses to the questions or remarks of the tenderer shall also be sent to all other tenderers. Pursuant to Section 9 Par. 3 S. 2 VgV (German public procurement regulation), the contract notice and the award documents are available to you at the German eVergabe with or without registration. Please note that registration is required for requests to participate, tender submissions and tenderer questions. We therefore recommend early registration, also in order to receive any tenderer information: you otherwise bear the risk of possible tender exclusion.

Objekt
Umfang der Beschaffung
Kurze Beschreibung:

The wafer bonder includes software which offers different user access levels for operating and engineering level. Bonding recipes for each wafer must be selectable individually.

In this wafer bonder the wafers are loaded automatically by a robot handler from at least 2 cassettes. The whole system contains at least 1 cleaning module, 1 plasma activation module, 1 fully automated bond aligner, 1 bond chamber and a wafer handling system. Further specifications for each module are given below. The wafer bonder includes software which offers different user access levels for operating and engineering level. Bonding recipes for each wafer must be selectable individually. The system has to be installed by the manufacturer as “stand-alone” or “through the wall” in the clean room at Fraunhofer IMS and must conform to CMOS compatible clean room conditions (dass 10). Fraunhofer IMS prepares the clean room for the system installation. The system has tobe designed for a 24h operation in all-year mode (continuous operation). For proven reliability the duster system, at least the bond chamber and the aligner, must be installed in more than 20 units worldwide in a production environment. The system has to allow a completely safe process run without any risk for the health of the operator (CE certificated) because of limited cleanroom space the mainframe of the bondersystem should have a footprint smaller than 4,2 m x 2,2 m. Electronic racks, vacuum pumps, and a separate user console are not included in this limitation.

Dauer: 10 Monate
Beschreibung der Optionen: See specification.
Ort der Leistung
Hauptstandort oder Erfüllungsort: 47057 Duisburg.

Rechtliche, wirtschaftliche, finanzielle und technische Informationen
Bedingungen für die Teilnahme
Wirtschaftliche und finanzielle Leistungsfähigkeit:

(1) Company profile and the actual amount of employees.

(2) Designation of the company revenue for the last 3 business years

(3) Self-declaration regarding the lack of exclusion criteria pursuant to § 123 and § 124 of the German Act Against Restraints of Competition (GWB).

(4) Excerpt from the Central Trade Register according to § 150a GewO (is requested by the client).

Technische und berufliche Fähigkeiten:

(1) Complete references (including contact persons with contact data) from comparable projects, which were realized in the last 3 years.

Auftragsausführung
Bedingungen für die Vertragserfüllung:

In the event that subcontractors are used, they must be named and their suitability is likewise to be substantiated on the basis of the listed documents under III.1). Furthermore, it must be confirmed that they will be available if the order is placed; their share in the scope of the contractual object must be stated.

Verfahren
Mindestzahl der Bewerber: 3
Höchstzahl der Bewerber: 5
Objektive Kriterien für die Auswahl der begrenzten Anzahl von Bewerbern: According suitability documents, references, turn over.
Zeitpunkt des Eingangs der Angebote: 23:59
Sprachen, in denen Angebote oder Teilnahmeanträge eingereicht werden können: Deutsch 🗣️
Englisch 🗣️

Öffentlicher Auftraggeber
Identität
Andere Art des öffentlichen Auftraggebers: Forschungsgesellschaft eV
Kontakt
Adresse des Käuferprofils: http://www.deutsche-evergabe.de/ 🌏
Dokumente URL: http://www.deutsche-evergabe.de/ 🌏

Referenz
Zusätzliche Informationen

Request of documents — available at: The award documents can be retrieved exclusively through the award portal of the German e-Vergabe at www.deutsche-evergabe.de

With the tender submission, contenders are also subject to the provisions regarding unsuccessful tenders (§ 134 GWB [German Act Against Restraints of Competition]). Questions or remarks from the tenderer must be sent, in English only, exclusively via email to the contact point named under nº I.1. As faras relevant, responses to the questions or remarks of the tenderer shall also be sent to all other tenderers.

Pursuant to Section 9 Par. 3 S. 2 VgV (German public procurement regulation), the contract notice and the award documents are available to you at the German eVergabe with or without registration.

Please note that registration is required for requests to participate, tender submissions and tenderer questions.

We therefore recommend early registration, also in order to receive any tenderer information: you otherwise bear the risk of possible tender exclusion.

Ergänzende Informationen
Körper überprüfen
Name: Vergabekammer des Bundes beim Bundeskartellamt
Postanschrift: Villemombler Straße 76
Postort: Bonn
Postleitzahl: 53123
Land: Deutschland 🇩🇪
Informationen zu Fristen für Nachprüfungsverfahren:

A request for review is inadmissible if more than 15 calendar days have passed since the receipt of the notification from the ordering party indicating a lack of willingness to help with the objection (§ 160 Par. 3 Clause 1 nº 4 GWB <German Act Against Restraints of Competition>). A request for review is additionally inadmissible if the contract has been awarded before the Vergabekammer <procurement review authority> has informed the ordering party of the request for review (§§ 168 Par. 2 Clause 1, 169 Par. 1 GWB). The award of the contract is possible 15 calendar days after the dispatch of the tenderer information pursuant to § 134 Par. 1 GWB. If the information is sent electronically or via fax, this time period is reduced to ten calendar days (§ 134 Par. 2 GWB). The time period begins on the day after the dispatch of the information by the ordering party: the day on which it is received at the concerned tenderer and applicant is not relevant. The admissibility of a request for review furthermore presupposes that a complaint has been made to the ordering party with regard to the asserted procurement violations within 10 days after knowledge was obtained of it(§ 160 Par. 3 Clause 1 nº 1 GWB). Complaints regarding violations of procurement rules that are apparent on the basis of the announcement must be made to the ordering party before the expiration of the time period named in the announcement for the application or for the tendering (§ 160 Par. 3 Clause 1 nº 1 GWB). Complaints regarding violations of procurement rules that do not become apparent until appearing in the award documents must be made to the ordering party no later than by the expiration of the time period for the application or for the tendering (§ 160 Par. 3 Clause 1 nº 1 GWB).

Für Mediationsverfahren zuständige Stelle
Name: Vergabeprüfstelle des BMBF Referat Z 23
Postanschrift: Heinemannstraße 2
Postleitzahl: 53175
Dienststelle, bei der Informationen über das Überprüfungsverfahren eingeholt werden können
Name: Fraunhofer Gesellschaft zur Förderung der angewandten Forschung eV über Vergabeportal eVergabe
Postanschrift: Hansastraße 27c
Postort: München
Postleitzahl: 80686
E-Mail: einkauf@zv.fraunhofer.de 📧
Internetadresse: http://www.fraunhofer.de 🌏
Quelle: OJS 2018/S 046-100468 (2018-03-05)

Ergänzende Angaben (2018-03-15)
Objekt
Umfang der Beschaffung
Kurze Beschreibung:

Fraunhofer IMS requires a new or refurbished fully automated wafer bonding system. In this system 8" (200 mm) wafers with different surface material (silicon oxide or silicon nitride) can be bonded together by a direct fusion bond according to the specifications below. The bond process can be performed under atmosphere or und er controlled vacuum (< le-5 mbar) with the possibility to encapsulate a gas (N2, Ar, etc.) under a specific pressure. In this wafer bonder the wafers are loaded automatically by a robot handler from at least two cassettes. The whole system contains at least one cleaning module, one plasma activation module, one fully automated bond aligner, one bond chamber and a wafer handling system. Further specifications for each module are given below. The wafer bonder includes software which offers different user access levels for operating and engineering level. Bonding recipes for each wafer must be selectable individually.

Metadaten der Bekanntmachung
Dokumenttyp: Ergänzende Angaben

Öffentlicher Auftraggeber
Identität
Name des öffentlichen Auftraggebers: Fraunhofer Gesellschaft zur Förderung der angewandten Forschung e.V. über Vergabeportal eVergabe

Referenz
Daten
Absendedatum: 2018-03-15 📅
Veröffentlichungsdatum: 2018-03-16 📅
Kennungen
Bekanntmachungsnummer: 2018/S 053-117339
Verweist auf Bekanntmachung: 2018/S 046-100468
ABl. S-Ausgabe: 53

Objekt
Umfang der Beschaffung
Kurze Beschreibung:

Fraunhofer IMS requires a new or refurbished fully automated wafer bonding system. In this system 8" (200 mm) wafers with different surface material (silicon oxide or silicon nitride) can be bonded together by a direct fusion bond according to the specifications below. The bond process can be performed under atmosphere or und er controlled vacuum (< le-5 mbar) with the possibility to encapsulate a gas (N2, Ar, etc.) under a specific pressure. In this wafer bonder the wafers are loaded automatically by a robot handler from at least two cassettes. The whole system contains at least one cleaning module, one plasma activation module, one fully automated bond aligner, one bond chamber and a wafer handling system. Further specifications for each module are given below.

Quelle: OJS 2018/S 053-117339 (2018-03-15)

Bekanntmachung über vergebene Aufträge (2019-02-04)
Objekt
Umfang der Beschaffung
Kurze Beschreibung:

Fraunhofer IMS requires a new or refurbished fully automated wafer bonding system. In this system 8" (200 mm) wafers with different surface material (silicon oxide or silicon nitride) can be bonded together by a direct fusion bond according to the specifications below. The bond process can be performed under atmosphere or under controlled vacuum (< le-5 mbar) with the possibility to encapsulate a gas (N2, Ar, etc.) under a specific pressure. In this wafer bonder the wafers are loaded automatically by a robot handler from at least 2 cassettes. The whole system contains at least one cleaning module, one plasma activation module, one fully automated bond aligner, one bond chamber and a wafer handling system. Further specifications for each module are given below. The wafer bonder includes software which offers different user access levels for operating and engineering level. Bonding recipes for each wafer must be selectable individually.

Gesamtwert des Auftrags: 0.01 EUR 💰
Metadaten der Bekanntmachung
Dokumenttyp: Bekanntmachung über vergebene Aufträge

Verfahren
Angebotsart: Entfällt

Referenz
Daten
Absendedatum: 2019-02-04 📅
Veröffentlichungsdatum: 2019-02-06 📅
Kennungen
Bekanntmachungsnummer: 2019/S 026-057539
ABl. S-Ausgabe: 26
Zusätzliche Informationen

— Request of documents — available at: The award documents can be retrieved exclusively through the award portal of the German e-Vergabe at www.deutsche-evergabe.de. With the tender submission, contenders are also subject to the provisions regarding unsuccessful tenders (§134 GWB [German Act Against Restraints of Competition]). Questions or remarks from the tenderer must be sent, in English only, exclusively via e-mail to the contact point named under No. I.1. As faras relevant, responses to the questions or remarks of the tenderer shall also be sent to all other tenderers. Pursuant to Section 9 Par. 3 S. 2 VgV (German public procurement regulation), the contract notice and the award documents are available to you at the German eVergabe with or without registration. Please note that registration is required for requests to participate, tender submissions and tenderer questions. We therfore recommend early registration, also in order to receive any tenderer information; you other wise bear the risk of possible tender exclusion.

Objekt
Umfang der Beschaffung
Kurze Beschreibung:

Fraunhofer IMS requires a new or refurbished fully automated wafer bonding system. In this system 8" (200 mm) wafers with different surface material (silicon oxide or silicon…

… nitride) can be bonded together by a direct fusion bond according to the specifications below. The bond process can be performed under atmosphere or under controlled vacuum (< le-5 mbar) with the possibility to encapsulate a gas (N2, Ar, etc.) under a specific pressure. In this wafer bonder the wafers are loaded automatically by a robot handler from at least 2 cassettes. The whole system contains at least one cleaning module, one plasma activation module, one fully automated bond aligner, one bond chamber and a wafer handling system. Further specifications for each module are given below.

… nitride)

Can be bonded together by a direct fusion bond according to the specifications below. The bond process can be performed under atmosphere or under controlled vacuum (< le-5 Mbar) with the possibility to encapsulate a gas (N2, Ar, etc.) under a specific pressure. In this wafer bonder the wafers are loaded automatically by a robot handler from at least 2 cassettes. The whole system contains at least one cleaning module, one plasma activation module, one fully automated bond aligner, one bond chamber and a wafer handling system. Further specifications for each module are given below. the wafer bonder includes software which offers different user access levels for operating and engineering level. Bonding recipes for each wafer must be selectable individually.

The system has to be installed by the manufacturer as “stand-alone" or “through the wall" in the clean room at Fraunhofer IMS and must conform to CMOS compatible clean room conditions (dass 10). Fraunhofer IMS prepares the clean room for the system installation. The system has to be designed for a 24 h operation in all-year mode (continuous operation).

For proven reliability the duster system, at least the bond chamber and the aligner, must be installed in more than 20 units worldwide in a production environment.

The system has to allow a completely safe process run without any risk for the health of the operator (CE certificated).

Because of limited cleanroom space the mainframe of the bonder system should have a footprint smaller than 4,2 m x 2,2 m. Electronic racks, vacuum pumps, and a separate user console are not included in this limitation.

Ort der Leistung
Hauptstandort oder Erfüllungsort: 47057 Duisburg

Verfahren
Vergabekriterien
Qualitätskriterium (Bezeichnung): Service
Qualitätskriterium (Gewichtung): 10
Qualitätskriterium (Bezeichnung): Delivery time
Qualitätskriterium (Gewichtung): 15
Qualitätskriterium (Bezeichnung): Technical spezifikation
Qualitätskriterium (Gewichtung): 40
Preis (Gewichtung): 35

Auftragsvergabe
Datum des Vertragsabschlusses: 2018-12-11 📅
Name: SUSS Micro Tec Lithography GmbH
Postanschrift: Schleissheimer Str. 90
Postort: Garching b. München
Postleitzahl: 85748
Land: Deutschland 🇩🇪
München, Landkreis 🏙️
Gesamtwert des Auftrags: 0.01 EUR 💰
Informationen über Ausschreibungen
Anzahl der eingegangenen Angebote: 2

Öffentlicher Auftraggeber
Identität
Andere Art des öffentlichen Auftraggebers: Forschungsgesellschaft e. V.

Referenz
Zusätzliche Informationen

— Request of documents — available at: The award documents can be retrieved exclusively through the award portal of the German e-Vergabe at

www.deutsche-evergabe.de. With the tender submission, contenders are also subject to the provisions regarding unsuccessful tenders (§134 GWB [German Act Against Restraints of Competition]). Questions or remarks from the tenderer must be sent, in English only, exclusively via e-mail to the contact point named under No. I.1. As faras relevant, responses to the questions or remarks of the tenderer shall also be sent to all other tenderers.

We therfore recommend early registration, also in order to receive any tenderer information; you other wise bear the risk of possible tender exclusion.

Ergänzende Informationen
Körper überprüfen
Informationen zu Fristen für Nachprüfungsverfahren:

A request for review is inadmissible if more than 15 calendar days have passed since the receipt of the notification from the ordering party indicating a lack of willingness to help with the objection (§ 160 Par. 3 Clause 1 No. 4 GWB <German Act Against Restraints of Competition>). A request for review is additionally inadmissible if the contract has been awarded before the Vergabekammer <procurement review authority> has informed the ordering party of the request for review (§§ 168 Par. 2 Clause 1, 169 Par. 1 GWB). The award of the contract is possible 15 calendar days after the dispatch of the tenderer information pursuant to § 134 Par. 1 GWB. If the information is sent electronically or via fax, this time period is reduced to ten calendar days (§ 134 Par. 2 GWB). The time period begins on the day after the dispatch of the information by the ordering party; the day on which it is received at the concerned tenderer and applicant is not relevant. The admissibility of a request for review furthermore presupposes that a complaint has been made to the ordering party with regard to the asserted procurement violations within 10 days after knowledge was obtained of it(§ 160 Par. 3 Clause 1 No. 1 GWB). Complaints regarding violations of procurement rules that are apparent on the basis of the announcement must be made to the ordering party before the expiration of the time period named in the announcement for the application or for the tendering (§ 160 Par. 3 Clause 1 No. 1 GWB). Complaints regarding violations of procurement rules that do not become apparent until appearing in the award documents must be made to the ordering party no later than by the expiration of the time period for the application or for the tendering (§ 160 Par. 3 Clause 1 No. 1 GWB).

Dienststelle, bei der Informationen über das Überprüfungsverfahren eingeholt werden können
Name: Fraunhofer Gesellschaft zur Förderung der angewandten Forschung e.V. über Vergabeportal eVergabe
Quelle: OJS 2019/S 026-057539 (2019-02-04)

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