Kurze Beschreibung
DUV-Exposure tool for 200 mm Si-Wafers (notch acc. to SEMI); Technology node: down to 150 nm; to be clustered with a wafer track (i.e. TEL ACT8 or similar); capability of front to backside alignment; including all components (i.e. Laser, Chiller, etc.) to operate the system; to be installed in a class 10 environment; Laser to be installed on the same floor, directly behind the tool, scanner or stepper, but stepper preferred.