Beschreibung der Beschaffung
General requirements:
— 200 mm wafer platform for RTP and plasma oxidation,
— Capable for at least two different process modules,
— Fully automated wafer load and unload with at least two loading ports (from/to 25 slot carrier – placed by an operator; preferred four loading ports),
— Tool installation in a cleanroom ISO 3 (class 3),
— Electrical connection requirements IHP: 230/400VAC 50 Hz TN-S Net (separated N/PE),
— Has to fulfill the actual „machinery, and amending Directive“ (EG-Maschinenrichtlinie),
— SEMI S2/S8 certified,
— Directive 2014/30/EU EMV must be fulfilled,
— Full CE-Confirmation,
— Wafer with notch,
— SECS II/GEM/HSMS interface,
— Wafer carrier type Entegris KA198-80M-47C02,
— Cluster Tool Control unit with appropriate software,
— Guaranteed service for more than 10 years,
— Delivery of the complete set of construction data (f. e. CAD files) and tool software for internal use (f. e. source code, SPS files, user interface),
— No refurbished system (chambers, parts),
— Additional 12 month warranty.
Software:
— Microsoft Windows 10,
— Unexpected software problems related to the standard operation have to be solved free of charge,
— All software changing regarding safety is free of charge,
— RAID-data storage.
Additional requirements:
— All manuals as hard copies on normal paper, cleanroom paper and on CD,
— Preventive maintenance schedule (parts, hours),
— User interface labels translated into german language,
— Safety and Operation manuals must be in German,
— Connection ability of the tool PC and the handling on the IHP uninterrupted power supply unit,
— Remote tool access for monitoring and for searching and viewing process logs and data trending,
— Second tool control unit in the maintenance area,
— Preferable ergonomic Human machine interface,
— Operator and maintenance training at customer's site,
— Pre installation box for all media (vacuum, water, cooling air, exhaust, Ethernet, gases, ect.),
— Delivery of an extended spare part kit free of charge,
— Source inspection,
— Support for process matching to existing RTP tool,
— Tool delivery according to INCOTERM 2010 DDP, DAP or CIP IHP.
Optional requirements:
— Support for development of new processes i.e. plasma oxidation of different materials (300 h on side process support).