The product specified in this document, the TSV-CVD tool, is a facility capable of processing silicon wafers of 200 mm in diameter under cleanroom class 10 conditions. The wafers are supplied by an operator in a standard 25 wafer cleanroom cassette. The TSV-CVD tool is able to automatically introduce the wafers into the TSV-CVD tools vacuum environment and run sequences of deposition processes on single wafers to coat their surfaces with thin layers of the materials. The TSV-CVD tool must be installed “through the wall”.
The primary goal of the tool is to deposit a material stack comprising an isolation layer, a diffusion barrier layer and a metal layer onto high aspect ratio via structures, which can act as a seed layer in a following copper ECD process (electro chemical deposition.
The tool must meet the following major claims:
See II.2.4) Description of the procurement:
Deadline
Die Frist für den Eingang der Angebote war 2019-02-18.
Die Ausschreibung wurde veröffentlicht am 2019-01-17.
Objekt Umfang der Beschaffung
Titel: TSV CVD tool
E_038_236286 cl-wit FMD
Produkte/Dienstleistungen: Diverse Maschinen und Geräte für besondere Zwecke📦
Kurze Beschreibung:
“The product specified in this document, the TSV-CVD tool, is a facility capable of processing silicon wafers of 200 mm in diameter under cleanroom class 10...”
Kurze Beschreibung
The product specified in this document, the TSV-CVD tool, is a facility capable of processing silicon wafers of 200 mm in diameter under cleanroom class 10 conditions. The wafers are supplied by an operator in a standard 25 wafer cleanroom cassette. The TSV-CVD tool is able to automatically introduce the wafers into the TSV-CVD tools vacuum environment and run sequences of deposition processes on single wafers to coat their surfaces with thin layers of the materials. The TSV-CVD tool must be installed “through the wall”.
The primary goal of the tool is to deposit a material stack comprising an isolation layer, a diffusion barrier layer and a metal layer onto high aspect ratio via structures, which can act as a seed layer in a following copper ECD process (electro chemical deposition.
The tool must meet the following major claims:
See II.2.4) Description of the procurement:
1️⃣
Ort der Leistung: Duisburg, Kreisfreie Stadt🏙️
Hauptstandort oder Erfüllungsort: 47057 Duisburg
Beschreibung der Beschaffung:
“The product specified in this document, the TSV-CVD tool, is a facility capable of processing silicon wafers of 200mm in diameter under cleanroom class 10...”
Beschreibung der Beschaffung
The product specified in this document, the TSV-CVD tool, is a facility capable of processing silicon wafers of 200mm in diameter under cleanroom class 10 conditions. The wafers are supplied by an operator in a standard 25 wafer cleanroom cassette. The TSV-CVD tool is able to automatically introduce the wafers into the TSV-CVD tools vacuum environment and run sequences of deposition processes on single wafers to coat their surfaces with thin layers of the materials. The TSV-CVD tool must be installed “through the wall.
The primary goal of the tool is to deposit a material stack comprising an isolation layer, a diffusion barrier layer and a metal layer onto high aspect ratio via structures, which can act as a seed layer in a following copper ECD process (electro chemical deposition.
The tool must meet the following major claims:
— The isolation layer, diffusion barrier layer and metal layer can be deposited in a highly conformal mode to achieve thin, yet highly conformal and isotropic deposition on micro via structures or 3D-MEMS,
— the isolation layer, diffusion barrier layer and metal layer can be deposited in a fast mode to achieve sufficient rates of deposition on TSV or micro via structures,
— diffusion barrier layer and seed layer processes can be run in sequences without breaking the vacuum, to prevent impurities or oxidation at the boundary layer,
— the isolation layer, diffusion barrier layer and seed layer are deposited in physically separated process chambers, to prevent cross contamination,
— the tool comprises an etching process to remove native oxides prior to deposition.
Typical processes for these tasks can be:
— SiO2 in CVD mode and/or in ALD mode as isolation layer,
— TiN in CVD mode and/or in ALD mode as diffusion barrier layer,
— Cu in CVD mode and/or in ALD mode as seed layer for Cu ECD,
— Ar sputter etching.
However, the tool may use different technical approaches or materials than the ones implied in this list, as long as the goals of these claims and the specifications of this tender are satisfied.
Mehr anzeigen Vergabekriterien
Der Preis ist nicht das einzige Zuschlagskriterium, und alle Kriterien werden nur in den Auftragsunterlagen genannt
Laufzeit des Vertrags, der Rahmenvereinbarung oder des dynamischen Beschaffungssystems
Der nachstehende Zeitrahmen ist in Monaten ausgedrückt.
Beschreibung
Dauer: 18
Informationen über die Begrenzung der Zahl der einzuladenden Bewerber
Vorgesehene Mindestanzahl: 3
Maximale Anzahl: 5
Objektive Kriterien für die Auswahl der begrenzten Anzahl von Bewerbern: According eligibility criteria.
Informationen über Optionen
Optionen ✅
Beschreibung der Optionen: Optinal you shold quote setup.
Rechtliche, wirtschaftliche, finanzielle und technische Informationen Bedingungen für die Teilnahme
Liste und kurze Beschreibung der Bedingungen:
“The documents listed below must be presented in full with the offer. Incomplete documents may lead to the exclusion of the proceedings.” Wirtschaftliche und finanzielle Leistungsfähigkeit
Liste und kurze Beschreibung der Auswahlkriterien:
“1) Company profile and the actual amount of employees;
2) Designation of the company revenue for the last 3 business years;
3) Self-declaration regarding...”
Liste und kurze Beschreibung der Auswahlkriterien
1) Company profile and the actual amount of employees;
2) Designation of the company revenue for the last 3 business years;
3) Self-declaration regarding the lack of exclusion criteria pursuant to § 123 and § 124 of the German Act Against Restraints of Competition (GWB);
4) Excerpt from the Central Trade Register according to § 150a GewO (is requested by the client).
Mehr anzeigen Technische und berufliche Fähigkeiten
Liste und kurze Beschreibung der Auswahlkriterien: (1) Equipment for cleanroom class 10
Bedingungen für den Vertrag
Bedingungen für die Vertragserfüllung:
“In the event that subcontractors are used, they must be named and their suitability is likewise to be substantiated on the basis of the listed documents...”
Bedingungen für die Vertragserfüllung
In the event that subcontractors are used, they must be named and their suitability is likewise to be substantiated on the basis of the listed documents under III.1). Furthermore, it must be confirmed that they will be available if the order is placed; their share in the scope of the contractual object must be stated.
Verfahren Art des Verfahrens
Wettbewerbliches Verfahren mit Verhandlung
Informationen über die Reduzierung der Anzahl von Lösungen oder Angeboten während der Verhandlungen oder des Dialogs
Rückgriff auf ein gestaffeltes Verfahren, um die Zahl der zu erörternden Lösungen oder zu verhandelnden Angebote schrittweise zu verringern
Administrative Informationen
Frist für den Eingang von Angeboten oder Teilnahmeanträgen: 2019-02-18
23:59 📅
Sprachen, in denen Angebote oder Teilnahmeanträge eingereicht werden können: Deutsch 🗣️
Sprachen, in denen Angebote oder Teilnahmeanträge eingereicht werden können: Englisch 🗣️
“— request of documents — available at: the award documents can be retrieved exclusively through the award portal of the German e-Vergabe at...”
— request of documents — available at: the award documents can be retrieved exclusively through the award portal of the German e-Vergabe at www.deutsche-evergabe.de. With the tender submission, contenders are also subject to the provisions regarding unsuccessful tenders (§134 GWB [German Act Against Restraints of Competition]). Questions or remarks from the tenderer must be sent, in English only, exclusively via e-mail to the contact point named under No. I.1. As far as relevant, responses to the questions or remarks of the tenderer shall also be sent to all other tenderers.
Pursuant to Section 9 Par. 3 S. 2 VgV (German public procurement regulation), the contract notice and the award documents are available to you at the German eVergabe with or without registration.
Please note that registration is required for requests to participate, tender submissions and tenderer questions.
We therfore recommend early registration, also in order to receive any tenderer information; you otherwise bear the risk of possible tender exclusion.
Mehr anzeigen Körper überprüfen
Name: Vergabekammer des Bundes beim Bundeskartellamt
Postanschrift: Villemombler Straße 76
Postort: Bonn
Postleitzahl: 53123
Land: Deutschland 🇩🇪 Für Mediationsverfahren zuständige Stelle
Name: Vergabekammer des Bundes beim Bundeskartellamt
Postort: Bonn
Land: Deutschland 🇩🇪 Verfahren zur Überprüfung
Genaue Informationen über Fristen für Überprüfungsverfahren:
“A request for review is inadmissible if more than 15 calendar days have passed since the receipt of the notification from the ordering party indicating a...”
Genaue Informationen über Fristen für Überprüfungsverfahren
A request for review is inadmissible if more than 15 calendar days have passed since the receipt of the notification from the ordering party indicating a lack of willingness to help with the objection (§ 160 Par. 3 Clause 1 No. 4 GWB ). A request for review is additionally inadmissible if the contract has been awarded before the Vergabekammer has informed the ordering party of the request for review (§§ 168 Par. 2 Clause 1, 169 Par. 1 GWB). The award of the contract is possible 15 calendar days after the dispatch of the tenderer information pursuant to § 134 Par. 1 GWB. If the information is sent electronically or via fax, this time period is reduced to 10 calendar days (§ 134 Par. 2 GWB). The time period begins on the day after the dispatch of the information by the ordering party; the day on which it is received at the concerned tenderer and applicant is not relevant. The admissibility of a request for review furthermore presupposes that a complaint has been made to the ordering party with regard to the asserted procurement violations within 10 days after knowledge was obtained of it(§ 160 Par. 3 Clause 1 No. 1GWB). Complaints regarding violations of procurement rules that are apparent on the basis of the announcement must be made to the ordering party before the expiration of the time period named in the announcement for the application or for the tendering (§ 160 Par. 3 Clause 1 No. 1 GWB). Complaints regarding violations of procurement rules that do not become apparent until appearing in the award documents must be made to the ordering party no later than by the expiration of the time period for the application or for the tendering (§ 160 Par. 3 Clause 1 No. 1 GWB).
Mehr anzeigen Dienststelle, bei der Informationen über das Überprüfungsverfahren eingeholt werden können
Name:
“Fraunhofer Gesellschaft zur Förderung der angewandten Forschung e.V. über Vergabeportal eVergabe”
Postanschrift: Hansastraße 27c
Postort: München
Postleitzahl: 80686
Land: Deutschland 🇩🇪
E-Mail: einkauf@zv.fraunhofer.de📧
URL: http://www.fraunhofer.de🌏
Quelle: OJS 2019/S 014-028133 (2019-01-17)