Auftragsgegenstand, CPA-Nummer: CPV: 30200000, 33200000. Bedarfsmeldung Nr. Wafer Prober System Fraunhofer IZM-M VI ATIS: The semi-automatic wafer prober shall be used for precision positioning and electrical probing on 300 mm-wafers. In general, we are aiming at a high flexibility between the application of low leakage DC-probing and impedance controlled RF-probing in a well defined environment. The following features should be available: 1) Wafer size <= 300 mm, safe vacuum fixturing of 150 mm and 200 mm wafers, steel with tungsten-layer, at least: CMOS-compatible grease, optional: true control of contact, force, theta control, optional: probe placement with optical pattern recognition fro high-temperature probing: - strategic requirement to enable high-end collaboration with the increasing number of semiconductor manufacturers with 300 mm-fabs; - CMOS-compatibility for potential reentry of tested wafers into CMOS-line. Precision goals over full temperature range, absolute xy: ± 5 ìm, relative xy: ± 2 ìm over 10 mm, z variation between center and edge, approx.: ± 5 ìm: - probing of small test pads below 50 ìm and internal nodes; - high pin count probing at the wafer edge. Thermo chuck - 65 ° C to + 200 ° C, 300 mm, 200 mm, 150 mm (main chuck): - probing in automotive temperature range. Satellite chuck for RF-calibration substrate: - 2". Satellite unit for needle cleaning: - AI203. Motorized XYZ microscope stage with large, high resolution monitor and video grabber: - remote control and monitoring; - laser trimming = laser cutting during electrical test; - precise contacts in distances exceeding the field of view. electrically and optically well-shielded (DC-RF), gas tight for purging purpose with dry N2: - prevent from electromagnetic interference; - prevent from illumination effects (e.g leakage currents); - temperature below dew point; - prevent from contact oxidation; - safe and flexible placement of manipulators. >= 6 precision xyz-manipulators and arms for needles and coplanar RF-probes with vacuum foot and sufficient zero vacuum stability optional: control of true contact force: - standard DC-probing with low leakage and defined pad darnage. 2 of the 6 manipulators woth motor drive: contacting of variable probe patterns and compplex topologies. probe card holder for 7" probe cards (easy mounting), optional: control of true contact force: - pre-requisit for the test of multiplin test structures and products. IEEE 488 interface and drivers easy integration into agilent VEE-test environment: - integration of test system. Laser cutter Ezlaze Trilite m., Mitutoyo FS70L4, long work distance objectives: 5x, 20x, G, 50x, 100x (NIR, G, NUV): - laser marking of failure and preparation sites before deprocessing and cross sectioning; - 5x, 20x overview, inspection; - NUV: local, fast removal of polyimide; - G: standard pourpose with focus on ocxide layers; - NIR: cutting of metal traces for circuit isolation and failure analysis. Shock absorbing table. Installation and training for min 2 persons incl. SW-control.
Deadline
Die Frist für den Eingang der Angebote war 2000-11-29.
Die Ausschreibung wurde veröffentlicht am 2000-11-17.
Auftragsbekanntmachung (2000-11-14) Objekt Umfang der Beschaffung
Titel: Waferprober
Volltext:
Auftragsgegenstand, CPA-Nummer: CPV: 30200000, 33200000. Bedarfsmeldung Nr. Wafer Prober System Fraunhofer IZM-M VI ATIS: The semi-automatic wafer prober shall be used for precision positioning and electrical probing on 300 mm-wafers. In general, we are aiming at a high flexibility between the application of low leakage DC-probing and impedance controlled RF-probing in a well defined environment. The following features should be available: 1) Wafer size <= 300 mm, safe vacuum fixturing of 150 mm and 200 mm wafers, steel with tungsten-layer, at least: CMOS-compatible grease, optional: true control of contact, force, theta control, optional: probe placement with optical pattern recognition fro high-temperature probing: - strategic requirement to enable high-end collaboration with the increasing number of semiconductor manufacturers with 300 mm-fabs; - CMOS-compatibility for potential reentry of tested wafers into CMOS-line. Precision goals over full temperature range, absolute xy: ± 5 ìm, relative xy: ± 2 ìm over 10 mm, z variation between center and edge, approx.: ± 5 ìm: - probing of small test pads below 50 ìm and internal nodes; - high pin count probing at the wafer edge. Thermo chuck - 65 ° C to + 200 ° C, 300 mm, 200 mm, 150 mm (main chuck): - probing in automotive temperature range. Satellite chuck for RF-calibration substrate: - 2". Satellite unit for needle cleaning: - AI203. Motorized XYZ microscope stage with large, high resolution monitor and video grabber: - remote control and monitoring; - laser trimming = laser cutting during electrical test; - precise contacts in distances exceeding the field of view. electrically and optically well-shielded (DC-RF), gas tight for purging purpose with dry N2: - prevent from electromagnetic interference; - prevent from illumination effects (e.g leakage currents); - temperature below dew point; - prevent from contact oxidation; - safe and flexible placement of manipulators. >= 6 precision xyz-manipulators and arms for needles and coplanar RF-probes with vacuum foot and sufficient zero vacuum stability optional: control of true contact force: - standard DC-probing with low leakage and defined pad darnage. 2 of the 6 manipulators woth motor drive: contacting of variable probe patterns and compplex topologies. probe card holder for 7" probe cards (easy mounting), optional: control of true contact force: - pre-requisit for the test of multiplin test structures and products. IEEE 488 interface and drivers easy integration into agilent VEE-test environment: - integration of test system. Laser cutter Ezlaze Trilite m., Mitutoyo FS70L4, long work distance objectives: 5x, 20x, G, 50x, 100x (NIR, G, NUV): - laser marking of failure and preparation sites before deprocessing and cross sectioning; - 5x, 20x overview, inspection; - NUV: local, fast removal of polyimide; - G: standard pourpose with focus on ocxide layers; - NIR: cutting of metal traces for circuit isolation and failure analysis. Shock absorbing table. Installation and training for min 2 persons incl. SW-control.
Auftragsgegenstand, CPA-Nummer: CPV: 30200000, 33200000. Bedarfsmeldung Nr. Wafer Prober System Fraunhofer IZM-M VI ATIS: The semi-automatic wafer prober shall be used for precision positioning and electrical probing on 300 mm-wafers. In general, we are aiming at a high flexibility between the application of low leakage DC-probing and impedance controlled RF-probing in a well defined environment. The following features should be available: 1) Wafer size <= 300 mm, safe vacuum fixturing of 150 mm and 200 mm wafers, steel with tungsten-layer, at least: CMOS-compatible grease, optional: true control of contact, force, theta control, optional: probe placement with optical pattern recognition fro high-temperature probing: - strategic requirement to enable high-end collaboration with the increasing number of semiconductor manufacturers with 300 mm-fabs; - CMOS-compatibility for potential reentry of tested wafers into CMOS-line. Precision goals over full temperature range, absolute xy: ± 5 ìm, relative xy: ± 2 ìm over 10 mm, z variation between center and edge, approx.: ± 5 ìm: - probing of small test pads below 50 ìm and internal nodes; - high pin count probing at the wafer edge. Thermo chuck - 65 ° C to + 200 ° C, 300 mm, 200 mm, 150 mm (main chuck): - probing in automotive temperature range. Satellite chuck for RF-calibration substrate: - 2". Satellite unit for needle cleaning: - AI203. Motorized XYZ microscope stage with large, high resolution monitor and video grabber: - remote control and monitoring; - laser trimming = laser cutting during electrical test; - precise contacts in distances exceeding the field of view. electrically and optically well-shielded (DC-RF), gas tight for purging purpose with dry N2: - prevent from electromagnetic interference; - prevent from illumination effects (e.g leakage currents); - temperature below dew point; - prevent from contact oxidation; - safe and flexible placement of manipulators. >= 6 precision xyz-manipulators and arms for needles and coplanar RF-probes with vacuum foot and sufficient zero vacuum stability optional: control of true contact force: - standard DC-probing with low leakage and defined pad darnage. 2 of the 6 manipulators woth motor drive: contacting of variable probe patterns and compplex topologies. probe card holder for 7" probe cards (easy mounting), optional: control of true contact force: - pre-requisit for the test of multiplin test structures and products. IEEE 488 interface and drivers easy integration into agilent VEE-test environment: - integration of test system. Laser cutter Ezlaze Trilite m., Mitutoyo FS70L4, long work distance objectives: 5x, 20x, G, 50x, 100x (NIR, G, NUV): - laser marking of failure and preparation sites before deprocessing and cross sectioning; - 5x, 20x overview, inspection; - NUV: local, fast removal of polyimide; - G: standard pourpose with focus on ocxide layers; - NIR: cutting of metal traces for circuit isolation and failure analysis. Shock absorbing table. Installation and training for min 2 persons incl. SW-control.
Ort der Leistung München, Kreisfreie Stadt🏙️ Metadaten der Bekanntmachung
Dokumenttyp: Ausschreibung
Art des Auftrags: Lieferauftrag
Verordnung: Europäische Gemeinschaften
Originalsprache: Deutsch 🗣️
Verfahren
Verfahrensart: Beschleunigte Verhandlungsverfahren
Vergabekriterien
Entfällt
Angebotsart: Nicht definiert
Art des öffentlichen Auftraggebers: Körperschaften
Öffentlicher Auftraggeber Identität
Name des öffentlichen Auftraggebers: Fraunhofer-Gesellschaft
Land: Deutschland 🇩🇪