2019-09-04Single-Wafer Nassätzanlage (Fraunhofer Gesellschaft zur Förderung der angewandten Forschung e.V. über Vergabeportal deutsche eVergabe)
Fraunhofer IMS requires a new or refurbished fully automated spin-etching-tool. In this system, 8” (200 mm) wafers can be processed according to the specifications below.
The system has to include the following modules:
— an automation module for wafer handling,
— a silicon wet-etching-chamber with an appropriable spin etch process (see specification document),
— a spin-rinse-dry-chamber,
— a measurement station for determination of wafer thickness or silicon film thickness pre and post etching (see …
Ansicht der Beschaffung » Erwähnte Lieferanten:Veeco GmbH