Ätzmodul

Fraunhofer-Gesellschaft

Auftragsgegenstand, CPA-Nummer: CPV: 31712100. Bedarfsmeldung Nr. Ätzmodul. Equipment for Wafer Backside Etching. The Fraunhofer Society, one of the leading research organizations in Europe, and its Institute for Reliability and Microintegration (IZM-M), department PCS in Munich, intend to purchase a wafer thinning tool, which is capable to etch semiconductor substrates. The equipment may be configured as a wet chemical processing unit or dry etching tool using plasma processes. The application will be stress relief and thinning of silicon wafers after grinding. The system must be able to handle and process wafers with 150 mm and 200 mm diameter. Handling of thin wafers with a remaining thickness of 100 ìm or below is a desirable option. Preferred features for the etching tool are high and homogeneous etching rates at temperatures below 150 °C (best would be below 100 °C) and low cost of ownership. As we will use this equipment mainly for research and development works flexibility in use is more important than wafer throughput. The equipment has to be suited for installation in a clean room environment and must fulfil European safety standards (CE certificate). Waferthinning, wet chemical spin-etching, dry etching, stress relief, backside etching, BESOI technology, smart card applications, Chip-in-Paper.

Die Frist für den Eingang der Angebote war 2000-08-03. Die Ausschreibung wurde veröffentlicht am 2000-07-25.

• • Fraunhofer-Gesellschaft

• • Mikroelektronische Maschinen und Geräte und Mikrosysteme › Mikroelektronische Maschinen und Geräte

• • Oberbayern › München, Kreisfreie Stadt