2018-03-05Automatischer Waferprober (Fraunhofer Gesellschaft zur Förderung der angewandten Forschung eV über Vergabeportal eVergabe)
Fraunhofer IMS requires a new or refurbished fully automated wafer bonding system. In this system 8" (200 mm) wafers with different surface material (silicon oxide or silicon nitride) can be bonded together by a direct fusion bond according to the specifications below. The bond process can be performed under atmosphere or under controlled vacuum (< le-5 mbar) with the possibility to encapsulate a gas (N2, Ar, etc.) under a specific pressure. In this wafer bonder the wafers are loaded automatically by a …
Ansicht der Beschaffung » Erwähnte Lieferanten:SUSS Micro Tec Lithography GmbH