2020-03-18Electrochemical System (Fraunhofer Gesellschaft zur Förderung der angewandten Forschung e.V. über Vergabeportal deutsche eVergabe)
The aim of the announced electrochemical system is to etch electrochemically porous silicon layers on silicon wafers in electrolytes containing hydrofluoric acid and alcohol. Homogenous formation of porous silicon layer on full wafer area till wafer edges with variation of thickness and porosity of porous layer not exceeding 15 % is required. The system has to provide batch processing of silicon wafers of square form with dimensions 156 x 156 mm (full-square and optionally pseudo-square) and of round …
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2020-02-10ALS-System (Fraunhofer Gesellschaft zur Förderung der angewandten Forschung e.V. über Vergabeportal deutsche eVergabe)
Fraunhofer ISIT plans to purchase an atomic layer deposition (ALD) system for a novel MEMS technology. The basic procedure is illustrated in the figure below. A mold pattern, created within a substrate for example by dry etching, is filled with loose micron-sized particles. Then the substrate is subjected to an ALD process. With optimized process conditions the initially loose particles are glued (agglomerated) at the points of contact to a rigid porous 3D structure over the whole mold depth by an ALD …
Ansicht der Beschaffung » Erwähnte Lieferanten:Picosun Europe GmbH
2020-01-081 x HIL Simulator (Fraunhofer Gesellschaft zur Förderung der angewandten Forschung e.V. über Vergabeportal deutsche eVergabe)
Subject of the invitation to tender is an HIL simulator system that will be installed in a scientific research and development laboratory of Fraunhofer ISE, performing Hardware-in-the-Loop (HIL) tests on electric energy components and systems. The technical purpose of the HIL simulator is the emulation of power electronic parts and grid components/systems in order to test the electric properties of distributed inverter driven energy systems, such as micro grids. Also certified testing of components, e.g. …
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2019-11-13Multiwafer 4-Zoll MOCVD (Fraunhofer Gesellschaft zur Förderung der angewandten Forschung e.V. über Vergabeportal deutsche eVergabe)
Semiconductor nitride materials, such as alloys of AlGaN epitaxial layers, must be deposited uniformly on wafers having a diameter of 100 mm or higher by the use of a Metalorganic chemical vapor deposition (MOCVD) system. This system must be capable to operate at wafer surface temperatures of 1 350 ˚C or above, in order to deposit AlN epitaxial layer on sapphire wafers with superior crystal quality, as well as to deposit high performing and uniform high electron mobility transistor (HEMT) structures on …
Ansicht der Beschaffung » Erwähnte Lieferanten:Aixtron Ltd
2019-10-18DWDM System (Fraunhofer Gesellschaft zur Förderung der angewandten Forschung e.V. über Vergabeportal deutsche eVergabe)
Ziel der Ausschreibung ist die Beschaffung der technischen Komponenten, mit denen 3 Institute des Leistungszentrum Digitale Vernetzung – Fraunhofer FOKUS, Fraunhofer HHI und Fraunhofer IPK – mittels DWDM Technologie an ein Glasfaserverbundnetz angeschlossen werden können. Es wird jeweils ein identisches DWDM-System an folgenden Standorten installiert:
— Fraunhofer HHI – Einsteinufer 37, 10587 Berlin,
— Fraunhofer IPK – Pascalstraße 8-9, 10587 Berlin,
— Fraunhofer FOKUS – Kaiserin-Augusta-Allee 31, 10589 Berlin.
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2019-10-17Electrochemical System (Fraunhofer Gesellschaft zur Förderung der angewandten Forschung e.V. über Vergabeportal deutsche eVergabe)
The aim of the announced electrochemical system is to etch electrochemically porous silicon layers on silicon wafers in electrolytes containing hydrofluoric acid and alcohol. Homogenous formation of porous silicon layer on full wafer area till wafer edges with variation of thickness and porosity of porous layer not exceeding 15 % is required. The system has to provide batch processing of silicon wafers of square form with dimensions 156 x 156 mm (full-square and optionally pseudo-square) and of round …
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2019-10-02Röntgendiffraktometer (Fraunhofer Gesellschaft zur Förderung der angewandten Forschung e.V. über Vergabeportal deutsche eVergabe)
The aim of the announced multipurpose x-ray diffractometer is the structural analysis of semiconductors and thin films. The device needs to measure high resolution rocking curves (Omega-2Theta-scans) and reciprocal space maps of various semiconductor mate-rials where the focus lies on throughput. Additionally, x-ray reflectivity measurements must be possible to determine the layer thicknesses of thin film samples. Switching between the measurements need to be quick and reproducible without time-consuming …
Ansicht der Beschaffung » Erwähnte Lieferanten:Malvern Panalytical GmbH
2019-09-27Resisttrack DUV (Fraunhofer Gesellschaft zur Förderung der angewandten Forschung e.V. über Vergabeportal deutsche eVergabe)
As a part of the stratgetic investment project „FMD“, a wafer track for DUV lithography is to be procured. Thereby the lithography at IPMS is significantly improved in terms of the resolution down to 110nm structure size and this also meets the increased technological requirements in the project areas of IPMS for 200mm wafer. The tool should consist of 2 coating modules, 2 developer modules, 9 hotplates (incl. 1 HMDS- hotplates), 5 cool plates for 200mm, a climate controlling system for coating module …
Ansicht der Beschaffung » Erwähnte Lieferanten:Tokyo Electron Europe Ltd
2019-09-20Raman Microscope (Fraunhofer Gesellschaft zur Förderung der angewandten Forschung e.V. über Vergabeportal deutsche eVergabe)
The Raman microscope combines highly-sensitive Raman spectroscopy with confocal imaging. With this setup it is possible to point-wisely record Raman spectra while scanning over the sample in x-, y- and z-direction and thus allows generating high-resolution 3D images of the chemical sample composition. The Raman microscope will be used to characterize a diversity of different samples such as semiconductors, polymers as well as biological samples.
Ansicht der Beschaffung » Erwähnte Lieferanten:Renishaw GmbH
2019-09-20Up to 3 Wind-Lidar-Measure Devices (Fraunhofer Gesellschaft zur Förderung der angewandten Forschung e.V. über Vergabeportal deutsche eVergabe)
A set of several (up to 3) wind measurement devices is to be purchased that assesses parameters for characterising the wind field in front of a wind turbine based on LiDAR technology. From the recordings of the combination of devices, it should be possible to derive the „free“ (undisturbed) wind velocity as well as the gradient of the mean wind speed with measurements in several distances to the turbine rotor (~ induction effects). In addition, it should be possible to derive the vertical and horizontal …
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2019-09-04Führungskräfte-Qualifizierung (Fraunhofer Gesellschaft zur Förderung der angewandten Forschung e.V. über Vergabeportal deutsche eVergabe)
Die Führungskräfte bei ihren Aufgaben bestmöglich zu unterstützen ist ein wichtiges Ziel der Fraunhofer-Gesellschaft.
Aus diesem Grund möchte die Fraunhofer-Gesellschaft ihr bestehendes Angebot zur Qualifizierung und Unterstützung von Führungskräfte überarbeiten mit dem Ziel, ein zentrales Führungskräfte-Qualifizierungsprogramm zu entwickeln.
Aus diesem Grund schreibt die Fraunhofer-Gesellschaft die Konzeption und Durchführung eines solchen Programms für die nächsten 4 Jahre aus.
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2019-09-04Single-Wafer Nassätzanlage (Fraunhofer Gesellschaft zur Förderung der angewandten Forschung e.V. über Vergabeportal deutsche eVergabe)
Fraunhofer IMS requires a new or refurbished fully automated spin-etching-tool. In this system, 8” (200 mm) wafers can be processed according to the specifications below.
The system has to include the following modules:
— an automation module for wafer handling,
— a silicon wet-etching-chamber with an appropriable spin etch process (see specification document),
— a spin-rinse-dry-chamber,
— a measurement station for determination of wafer thickness or silicon film thickness pre and post etching (see …
Ansicht der Beschaffung » Erwähnte Lieferanten:Veeco GmbH
2019-07-18Sensor Mold Tool (Fraunhofer Gesellschaft zur Förderung der angewandten Forschung e.V. über Vergabeportal deutsche eVergabe)
Fraunhofer IZM is planning to purchase a 300 x 300 mm sensor-equipped mold tool for use in APIC Yamada Panel Molding Machine. System focus is the in-situ measurement of process data during encapsulation as one key process step of the fan-out panel level packaging process chain. The system should deliver accurate data from temperature-, pressure- and dielectric sensors distributed over the whole molding area. Sensor surfaces will be protected by ETFE-tape during encapsulation process. Furthermore, it is …
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2019-07-17UV-LED Maskaligner (Fraunhofer Gesellschaft zur Förderung der angewandten Forschung e.V. über Vergabeportal deutsche eVergabe)
The purpose of the UV-LED-maskaligner is to structure a light-sensitive resist, coated onto the surface of III-V wafers, by ultra-violet (UV) light according to a designed layout. By structuring the light-sensitive resist according to a layout, the wafer-surface underneath can be subsequently structured by local material deposition or by local etching.
Technical details of the UV-LED-maskaligner are listed in the specifications. The exact technical implementation has to be evaluated and discussed again …
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