2012-10-23Atomic Layer Deposition (ALD) System (Karlsruhe Institute of Technology (KIT) - Campus Nord)
The ALD system is supposed to be used by different users of several institutes, so the requirements to the system are diverse, ranging from coating of flat wafers and high aspect ratio nano structures, over complex 3D objects towards microparticulate powders. Regarding ALD materials, the system should be very versatile, allowing for deposition of metals (such as e.g. Pt, Ru, Ag, Ir, Cu,,...), oxides (e.g. SrTiO3, TiO2, SiO2, HfO2, Al2O3, ZrO2, MgO ...) and possibly nitrides (e.g. TiN, TaN, AlN,...) and …
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